Place of Origin : Shenzhen, China
Brand Name : WonDa
Packaging Details : Vacuum bag + Outer carton
Base Material : FR4,FR1,CEM3,Aluminum,Ceramic
Copper Thickness : 1oz~4oz
Board Thickness : 0.5~3.2mm
Min. Hole Size : 0.15mm
Min. Line Width : 0.08mm
Min. Line Spacing : 0.08mm
Surface Finishing : HASL,Lead Free HASL, OSP,ENIG,Gold plating
Layer : 1~20 layers
Max. Panel Size : 541*647mm(Special can do to 950mm)
Finish Hole Size : PTH +/-0.003'' ,NPTH +/-0.002
Min Plated Drills To Copper : 0.25mm, 0.30mm
Certification : CE, ROHS, UL
MOQ : None
Price : Negotiable
Delivery Time : 5-15 days
Payment Terms : T/T, W.U, L/C
Supply Ability : 10000 Sq.meter/month
Double layer pcb for power bank
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PCB Engineering Capacity
No. | Item | Spec |
1 | Layers | 1 to 24 layers |
2 | Max working panel area | 457 x 610 mm |
3 | Min board thickness | 4 layer: 0.40mm |
6 layer: 0.80mm | ||
8 layer: 1.00mm | ||
10 layer: 1.20mm | ||
4 | Min trace width | 0.10mm |
5 | Min spacing | 0.10mm |
6 | Min hole diameter | 0.20mm |
7 | Min Copper thickness in hole | 0.020mm |
8 | PTH size tolerance | ±0.05mm |
9 | NPTH size tolerance | ±0.025mm |
10 | Hole position tolerance | ±0.05mm |
11 | Dimension tolerance | ±0.1mm |
12 | Min solder mask dam | 0.08mm |
13 | Insulation resistance | 1E+12Ω (normal condition) |
14 | Max Board thickness/Hole size Rate | '10:01:00 AM |
15 | Thermal shock endurance | 288 3 times in 10sec |
16 | Max Board twist and wrap | ≤0.7% |
17 | High Vlotage endurance | 1.3KV/mm |
18 | Copper foil peel off endurance | 1.4N/mm |
19 | Hardness of resist ink | ≥6H |
20 | Flame resistance | 94V-0 |
21 | Impedance control | ±5% |
22 | Certificate |
ISO 9001:2000;ISO 14001;ISO/TS16949:2002 ,UL E203640 |
PCB QC System
FR4 , FR1 Double layer pcb Lead Free HASL , OSP for power bank 0.08mm Min. Line Images |